RFQ MSDS Team Education Resources

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Electronics: CMW created Thermkon® Copper-Tungsten and Thermkon® Copper-Molybdenum to help meet the demands of today's high-performance, high-reliability electronics.

Heat is the major cause of microsystem failure. Thermkon® solves that problem by dissipating heat from the chip at rates up to 110 BTU/h/ft/F° or 190 w/m/K. The degree of dissipation you require will help determine which of the Thermkon® composite materials should be used for your application.

Thermkon® also features a low coefficient of thermal expansion which eliminates the problem of chip failure due to thermal cycling stress. The coefficient of thermal expansion can be tailored to match the chip or ceramic's thermal expansion.

Thermkon® heat sink materials can be fabricated in sizes, thicknesses, and shapes to meet the needs of virtually any application. Surfaces are ground to assure flatness within .001 inch per inch of the longest dimension. CMW takes every care to produce only the highest quality heat sinks.

Thermkon® is ideal for applications such as:

• Discrete flanges for NPN silicon bipolar power transistors
• GaAs FET carriers
• Flat Pack bases to match thermal and coefficient requirements of thick and thin film circuitry.
• Machined housings for amplifiers and mixers

Thermkon® is also ideally suited to a wide range of other applications. Please consult the Thermkon® Brochure to learn more — or contact us directly at metals@cmwinc.com.